[VLP] Faylka Naxaasta ED oo Aad u hooseeya
![[VLP] Profile aadka u hooseeya ED Foil Naxaas ah Sawirka](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Hordhac Product
VLP, foil naxaas ah oo muuqaalkiisu aad u hooseeyo oo ay soo saarto CIVEN METAL ayaa leh astaamaha qallafsanaanta hooseeya iyo xoogga diirka sare.Foornada naxaasta ah ee ay soo saarto habka korantada ayaa leh faa'iidooyinka nadiifnimada sare, wasakhda hoose, dusha siman, qaabka guddiga siman, iyo ballac ballaaran.Foornada naxaasta ah ee korantada ayaa si fiican loogu dhejin karaa qalab kale ka dib marka la qallajiyo hal dhinac, mana fududa in la diiriyo.
Tilmaamaha
CIVEN waxay ku siin kartaa heerkul aad u hooseeya oo heerkulkiisu sareeyo ductile electrolytic copper foil (VLP) min 1/4oz ilaa 3oz ( dhumucdiisuna tahay 9µm ilaa 105µm), cabirka badeecada ugu badana waa 1295mm x 1295mm xaashida naxaasta ah.
Waxqabadka
CIVEN Waxay siisaa foil naxaas ah oo ultra- dhumuc weyn leh oo leh astaamo jireed oo aad u wanaagsan oo ah crystal fine equiaxial, profile hoose, xoog sare iyo dherer sare.(Fiiri shaxda 1)
Codsiyada
Lagu dabaqi karo soo saarista looxyada wareegyada awoodda sare leh iyo looxyada soo noqnoqda ee baabuurta, korontada, isgaarsiinta, militariga iyo hawada sare.
Astaamaha
Isbarbardhigga badeecadaha shisheeye ee la midka ah.
1.The qaab-dhismeedka hadhuudh of our VLP bireed electrolytic copper waxaa loo siman yahay spherical crystal ganaax;halka qaab-dhismeedka hadhuudhka ee badeecadaha shisheeye ee la midka ah uu yahay tiir iyo dheer.
2. Fool naxaas ah oo korantada ah waa muuqaal aad u hooseeya, 3oz bireed naxaas ah oogada guud ee Rz ≤ 3.5µm;halka alaabada ajnabiga ah ee la midka ah ay yihiin astaanta caadiga ah, 3oz naxaas foil dusha sare Rz> 3.5µm.
Faa'iidooyinka
1.Since alaabtayadu waa profile ultra-hooseeya, waxay xallisaa khatarta iman karta ee wareegga gaaban ee khadka sababtoo ah qallafsanaanta weyn ee caarada naxaasta ah ee qaro weyn iyo dhexgalka sahlan ee xaashida khafiifka ah ee khafiifka ah ee "ilka yeey" marka la cadaadiyo guddi laba-dhinac ah.
2.Sababta oo ah qaab-dhismeedka hadhuudhka ee alaabtayada waxaa loo siman yahay spherical crystal ganaax, waxay soo gaabinaysaa waqtiga line etching iyo hagaajinaysaa dhibaatada ee etching dhinaca line sinnayn.
3, iyadoo leh xoogga diirka sare, aan lahayn wareejin budo naxaas ah, garaafyo cad oo PCB wax soo saar leh.
Waxqabadka (GB/T5230-2000, IPC-4562-2000)
| Kala soocidda | Unug | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Cu Content | % | ≥99.8 | ||||||
| Miisaanka Goobta | g/m2 | 80±3 | 107±3 | 153±5 | 283± 7 | 585±10 | 875±15 | |
| Xoogga Jilicsan | RT(23 ℃) | Kg/mm2 | ≥28 | |||||
| HT (180 ℃) | ≥15 | ≥18 | ≥20 | |||||
| Dheeraynta | RT(23 ℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT (180 ℃) | ≥6.0 | ≥8.0 | ||||||
| Qalafsanaan | Shiny (Ra) | μm | ≤0.43 | |||||
| Matte (Rz) | ≤3.5 | |||||||
| Xoogga diirka | RT(23 ℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Heerka hoos loo dhigay ee HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||||
| Isbedelka midabka (E-1.0hr/200 ℃) | % | Wacan | ||||||
| Alxan Sabaynta 290 ℃ | Sek | ≥20 | ||||||
| Muuqashada (Barta iyo budada naxaasta) | ---- | Midna | ||||||
| Pinhole | EA | Eber | ||||||
| Dulqaadka cabbirka | Ballaca | mm | 0 ~ 2mm | |||||
| Dhererka | mm | ---- | ||||||
| Xudunta | mm/inch | Dhexroorka 79mm/3 inch | ||||||
Fiiro gaar ah:1. Qiimaha Rz ee foornada naxaasta ah ee dusha sare waa qiimaha deggan ee tijaabada, maaha qiime la dammaanad qaaday.
2. Xoogga diirka waa heerka tijaabada guddiga FR-4 (5 xaashi oo ah 7628PP).
3. Muddada hubinta tayada waa 90 maalmood laga bilaabo taariikhda la helay.
![[RTF] Dib u laabo ED-daaweedka Naxaasta ee la daweeyay](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Batteri ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[HTE] Foil Naxaas ah oo Dheeraad ah ED](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)