Daawaynta Dabiiciga ah ee Naxaasta ah: "Anchor Lock" Farsamada Wajiga ee Farsamada iyo Falanqaynta Codsiga Dhamaystiran

Gudaha garoonkabireed naxaas ahwax soo saarka, qallafsanaanta daawaynta ka dib waa habka ugu muhiimsan ee lagu furayo xoogga isku xidhka walxaha. Maqaalkani wuxuu falanqeynayaa baahida loo qabo daaweynta qallafsan ee saddex dhinac: saamaynta ku-xidhka farsamada, hababka hirgelinta habka, iyo la qabsiga isticmaalka dhammaadka. Waxa kale oo ay sahamisaa qiimaha codsiga ee tignoolajiyadan dhinacyada sida isgaarsiinta 5G iyo baytariyada tamarta cusub, oo ku salaysanBIRTA CIVENhorumarka farsamada.

1. Daawaynta Qalafsan: Laga bilaabo "Dabin Wanaagsan" ilaa "Interface Anchored"

1.1 ciladaha dilaaga ah ee dusha wanaagsan

Qalafsanaanta asalka ah (Ra) eebireed naxaas ahDusha sare ayaa caadi ahaan ka yar 0.3μm, taas oo u horseedda arrimaha soo socda sababo la xiriira sifooyinkeeda u eg muraayadda:

• Isku xidhid Jireed oo aan ku filnayn: Meesha xiriirka leh xabagta waa 60-70% kaliya ee qiimaha aragtida.
• Caqabadaha Isku Xidhka KiimikadaLakabka oksaydhka cufan (Cu₂O dhumucdiisuna waxay tahay 3-5nm) waxay hor istaagtaa soo bandhigida kooxaha firfircoon.
• Dareenka Cadaadiska KulaylkaFarqiga u dhexeeya CTE (Coefficient of Thermal Expansion) waxay keeni kartaa delamination interface (ΔCTE = 12ppm/°C).

1.2 Saddex Farsamo oo Horumarineed oo Muhiim ah oo ku jira Hannaanka Qalafsanaanta

Adiga oo abuuraya qaab-dhismeed saddex-cabbir ah oo heer-yar-yar ah (fiiri sawirka 1), lakabka qallafsan wuxuu gaadhayaa:

• Farsamaynta Dhexdhexaadinta: Foomamka gelitaanka resinka ee "barbed" ku xidhidh (qoto dheer> 5μm).
• Dhaqdhaqaaqa Kiimikada: Soo bandhigida (111) diyaaradaha firfircoonida leh waxay kordhisaa cufnaanta goobta isku xidhka ilaa 10⁵ sites/μm².
• Dejinta Cadaadiska KulaylkaQaab dhismeedka daloolku wuxuu nuugaa in ka badan 60% diiqada kulaylka.
• Wadada Geedi socodka: Xalka dahaadhka naxaasta aysiidhka ah (CuSO₄ 80g/L, H₂SO₄ 100g/L)
• Tilmaamaha Dhismaha:
  • Dhererka dendrite Copper 1.2-1.8μm, dhexroor 0.5-1.2μm.
  • Waxa ku jira oksijiinta dushiisa ≤200ppm (Falanqaynta XPS).
  • Iska caabinta xidhiidhka <0.8mΩ·cm².
• Wadada Geedi socodka: Cobalt-nickel dahaarka dahaadhka ah (Co²+ 15g/L, Ni²+ 10g/L) + Falcelinta Barakaca Kiimikada (pH 2.5-3.0)
• Tilmaamaha Dhismaha:
  • Cabbirka walxaha CoNi alloy 0.3-0.8μm, cufnaanta cufnaanta> 8 × 10⁴ qaybo / mm².
  • Waxa ku jira oksijiinta dushiisa ≤150ppm.
  • Iska caabinta xidhiidhka <0.5mΩ·cm².

2. Red Oxidation vs. Black Oxidation: Siraha Geedi socodka ee ka dambeeya Midabka

2.1 Oxidation Cas: "Hubka" Copper

2.2 Madow Oxidation: Alloy "Armor"

2.3 Caqliga Ganacsiga ee ka dambeeya Xulashada Midabka

Inkasta oo tilmaamayaasha waxqabadka muhiimka ah (adhesion iyo conductivity) ee oksaydhka cas iyo madow ay ku kala duwan yihiin wax ka yar 10%, suuqa ayaa muujinaya kala duwanaansho cad:

• Faylka Naxaasta Oxidized Casaanka ah: Waxay ku xisaabtamaysaa 60% saamiga suuqa sababtoo ah faa'iidada qiimaha badan ee ay leedahay (12 CNY/m² vs. madow 18 CNY/m²).
• Foornada Naxaasta Oxidized Madow: Wuxuu maamulaa suuqa-dhamaadka sare (FPC-baabuur-ku-saaran, PCB-yada milimiter-wave) oo leh 75% saamiga suuqa sababtoo ah:
  • 15% hoos u dhaca khasaaraha soo noqnoqda (Df = 0.008 vs. oksaydhaynta cas 0.0095 at 10GHz).
  • 30% waxay hagaajisay caabbinta CAF (Conductive Anodic Filament).

3. BIRTA CIVEN: "Nano-Level Masters" ee Tignoolajiyada Roughening

3.1 Tignoolajiyada cusub ee "Roughening Gradient".

Iyadoo loo marayo kontorool habka saddex-marxalad ah,BIRTA CIVENwaxay hagaajisaa qaab dhismeedka dusha sare (eeg sawirka 2):

1. Lakabka Abuurka Nano-Crystalline: Dhigista korantada ee koodhka naxaasta 5-10nm cabbir ahaan, cufnaanta> 1×10¹¹ qaybo/cm².
2. Kobaca Micron Dendrite: Pulse hadda waxay koontaroolaysaa jihada dendrite (mudnaan siinaysa jihada (110).
3. Gudbinta Dusha sare: Wakiilka isku xirka silane ee dabiiciga ah (APTES) daahan wuxuu hagaajiyaa caabbinta oksaydhka.

3.2 Waxqabadkii Ka Sarreeyey Heerarka Warshadaha

3.3 Isticmaalka Dhamaadka Isticmaalka Matrix

• Saldhigga 5G PCB: Waxay isticmaashaa foil naxaas ah oo oksaydhized madow ah (Ra = 1.5μm) si loo gaaro <0.15dB/cm luminta galinta 28GHz.
• Korantada Batteriyaasha: Red oksaydhaysanbireed naxaas ah(Xoogga adkaysiga 380MPa) waxay bixisaa nolol wareeg ah> 2000 wareegyo (heer qaran 1500 wareegyo).
• Aerospace FPCsLakabka qallafsan wuxuu u adkeysanayaa shoogga kulaylka -196°C ilaa +200°C 100 wareeg oo aan delamination lahayn.

4. Goobta dagaalka ee mustaqbalka ee foornada naxaasta ah ee la qooyay

4.1 Tignoolajiyada aad u qallafsan

Shuruudaha isgaarsiineed ee 6G terahertz, qaab-dhismeed sixiran oo leh Ra = 3-5μm ayaa la soo saarayaa:

• Deganaanshaha Joogtada ah ee DielectricWaxaa loo hagaajiyay ΔDk <0.01 (1-100GHz).
• Iska caabinta kulaylka: La dhimay 40% (gaaritaanka 15W/m·K).

4.2 Nidaamyada Roughening Smart

Isku darka ogaanshaha aragga AI + hagaajinta habka firfircoon:

• Korjoogteynta Dusha-Waqtiga dhabta ah: Sambalka inta jeer ee 100 fareeshka ilbiriqsikii.
• La qabsiga Cufnaanta HaddaXaqiijinta ±0.5A/dm².

Qalafsanaanta naxaasta ka dib daawaynta ka dib waxay ka soo baxday "hab doorasho" una gudubtay "waxqabad laxaadle." Iyadoo loo marayo hal-abuurnimo habka iyo xakamaynta tayada aadka u daran,BIRTA CIVENwaxay ku riixday tignoolajiyada qallafsan ee saxda ah ee heerka atomiga, iyada oo siinaya taageero qalab aasaasi ah cusboonaysiinta warshadaha elektiroonigga ah. Mustaqbalka, tartanka loogu jiro xariifnimo, soo noqnoqosho sare, iyo tignoolajiyada la isku halayn karo, ku alla kii ku guulaysta "code-ka-yar" ee tignoolajiyada qallafsan ayaa maamuli doona istaraatiijiyada sare eebireed naxaas ahwarshadaha.

(Isha xogta:BIRTA CIVEN2023 Warbixinta Farsamada Sannadlaha ah, IPC-4562A-2020, IEC 61249-2-21)