Neefsashadu waa habka udub-dhexaadka u ah soo saarista duubanbireed naxaas ah. Waxay u shaqeysaa sidii " gaashaanka heerka molecular " ee dusha sare, iyadoo kor u qaadaysa iska caabbinta daxalka iyadoo si taxadar leh u dheelitiraysa saameynta ay ku leedahay sifooyinka muhiimka ah sida korantada iyo alxanka. Maqaalkani waxa uu si qoto dheer u galayaa sayniska ka dambeeya hababka passivation, ganacsiga-offs-offs, iyo dhaqanka injineernimada. IsticmaalkaBIRTA CIVENHorumarka uu sameeyay tusaale ahaan, waxaanu sahamin doonaa qiimaha gaarka ah ee ay ku leedahay soo saarista elektiroonigga sare.
1. Passivation: A "Molecular-Level Shield" ee foornada naxaasta ah
1.1 Sida uu u sameeyo lakabka Passivation
Iyada oo loo marayo daawaynta kiimikaad ama korantada, lakabka oksaydh ee is haysta ee 10-50nm ayaa ka samaysan dusha sare eebireed naxaas ah. Ka kooban Cu₂O, CuO, iyo ka samaysan organic, lakabkani waxa uu bixiyaa:
- Caqabadaha Jireed:Iskudarka faafinta ogsijiinta ayaa hoos u dhacaysa ilaa 1×10⁻¹⁴ cm²/s
- Baadhitaanka Kiimikada Korantada:Cufnaanta daxalka hadda waxay hoos uga dhacdaa 10μA/cm² ilaa 0.1μA/cm².
- Firfircoonida Kiimikada:Tamarta xorta ah ee dusha sare ayaa laga soo yareeyay 72mJ/m² ilaa 35mJ/m², iyada oo xakamaynaysa habdhaqanka falcelinta.
1.2 Shan Faa'iidooyin oo Muhiim u ah Baadhista
| Dhinaca Waxqabadka | Fool Naxaas ah oo aan la daweyn | Faylka Naxaasta ah ee Qarsoon | Hagaajinta |
| Imtixaanka buufinta milixda (saacadaha) | 24 (dhibcood miridhku muuqda) | 500 (ma jiraan daxal muuqda) | + 1983% |
| Heerkulka Heerkulka Sare (150°C) | 2 saacadood (wuxuu noqdaa madow) | 48 saacadood (midabka ayuu hayaa) | +2300% |
| Nolosha Kaydinta | 3 bilood (vacuum-ka buuxaan) | 18 bilood (heerka la soo buuxiyay) | + 500% |
| Iska caabinta xidhiidhka (mΩ) | 0.25 | 0.26 (+4%) | - |
| Khasaaraha Gelida Soo noqnoqoshada Sare (10GHz) | 0.15dB/cm | 0.16dB/cm (+6.7%) | - |
2. "Seefta Laba Af leh" ee lakabyada Passivation-iyo sida loo dheelitiro
2.1 Qiimaynta Khatarta
- Waxooga dhimis ah xagga Hab-dhaqanka:Lakabka passivation wuxuu kordhiyaa qoto dheer maqaarka (10GHz) laga bilaabo 0.66μm ilaa 0.72μm, laakiin iyadoo la ilaalinayo dhumucda ka hooseeya 30nm, korodhka caabbinta waxay ku koobnaan kartaa wax ka yar 5%.
- Caqabadaha Iibka:Tamarta dusha hoose waxay kordhisaa xagasha qoynta alxanka min 15° ilaa 25°. Isticmaalka koollada firfircoon ee alxanka leh (nooca RA) ayaa wax ka beddeli kara saameyntan.
- Arrimaha Adhesion:Xoogga isku xidhka resin waxa laga yaabaa inuu hoos u dhaco 10-15%, taas oo lagu yarayn karo marka la isku daro habsocod qallafsan iyo habsocod.
2.2BIRTA CIVENHabka Isku dheelitirka
Farsamada Tignoolajiyada Passiving Gradient:
- Lakabka Saldhig:Kobaca kiimikaad ee 5nm Cu₂O oo leh (111) hanuunin la door biday.
- Lakabka Dhexe:2–3nm benzotriazole (BTA) filim iskiis isu abaabulay.
- Lakabka dibadda:Wakiilka isku xirka Silane (APTES) si kor loogu qaado adhesion resin.
Natiijooyinka Waxqabadka La Habeeyay:
| Metric | IPC-4562 Shuruudaha | BIRTA CIVENNatiijooyinka Foolka Naxaasta |
| Iska caabinta Dusha (mΩ/sq) | ≤300 | 220-250 |
| Xoogga diirka (N/cm) | ≥0.8 | 1.2–1.5 |
| Alxanka Isku-dhafka Xoojinta (MPa) | ≥25 | 28–32 |
| Heerka Socdaalka Ionic (μg/cm²) | ≤0.5 | 0.2–0.3 |
3. BIRTA CIVENTignoolajiyada Gudbinta: Dib u qeexida Heerarka Ilaalinta
3.1 Nidaamka Ilaalinta Afar-Tier
- Xakamaynta oksaydhka- khafiifka ah:Anodization-ka garaaca wuxuu gaaraa kala duwanaanshiyaha dhumucda gudaha ± 2nm.
- Lakabyada Isku-dhafan ee Noolaha-Inorganic:BTA iyo silane waxay wada shaqeeyaan si loo dhimo heerka daxalka ilaa 0.003mm/sanadkii.
- Daawaynta Dhaqdhaqaaqa Dusha sare:Nadiifinta balaasmaha (Gaaska Ar/O₂ isku dhafka ah) waxay dib u soo celisaa xagasha qoynta alxanka ilaa 18°.
- Kormeerka-waqtiga dhabta ah:Ellipsometry waxay hubisaa dhumucda lakabka passivation gudaha ± 0.5nm.
3.2 Xaqiijinta Deegaanka Ba'an
- Qoyaanka sare iyo kulaylka:Kadib 1,000 saacadood oo ah 85°C/85% RH, iska caabbinta dusha sare waxay isbedeshaa wax ka yar 3%.
- Shock kulaylka:Kadib wareegyada 200 ee -55°C ilaa +125°C, wax dildilaac ah kama soo baxayaan lakabka passivation (oo ay xaqiijisay SEM).
- Iska caabinta Kiimikada:Iska caabinta 10% uumiga HCl wuxuu ka kordhaa min 5 daqiiqo ilaa 30 daqiiqo.
3.3 Waafaqid Guud ahaan Codsiyada
- Anteennada 5G Millimeter-Wave:Luminta gelinta 28GHz ayaa hoos loo dhigay kaliya 0.17dB/cm (marka la barbar dhigo tartamayaasha '0.21dB/cm).
- Gawaarida Elektarooniga ah:Gudub ISO 16750-4 tijaabooyinka buufinta milixda, oo leh wareegyo la dheereeyey ilaa 100.
- Substrates IC:Awoodda isku dhejinta leh xabagta ABF waxay gaartaa 1.8N/cm (celceliska warshadaha: 1.2N/cm).
4. Mustaqbalka Tignoolajiyada Passivation
4.1 Tignoolajiyada dhigaalka lakabka atomiga ah (ALD).
Soo saarista filimada passivation nanolaminate oo ku salaysan Al₂O₃/TiO₂:
- Dhumucda:<5nm, oo leh koror caabbinta ≤1%.
- CAF (Filament Anodic Filament Anshaxeed) Caabin ah:5x horumar.
4.2 Lakabyada Gudbinta Is-bogsiinta
Isku darka ka hortagga daxalka microcapsule (Benzimidazole derivatives):
- Waxtarka Is-bogsiinta:In ka badan 90% 24 saacadood gudahood ka dib xagashada.
- Nolosha Adeegga:Kordhinta ilaa 20 sano (marka la barbardhigo heerka 10-15 sano).
Gabagabo:
Daawaynta ku-tiirsanaanta waxay gaadhaysaa dheelitirnaan la safeeyey oo u dhexeeya ilaalinta iyo shaqaynta duubanbireed naxaas ah. Iyadoo loo marayo hal-abuurnimo,BIRTA CIVENwaxa ay yaraynaysaa hoos u dhaca dafiska, isaga oo u rogaya "hubka aan la arki karin" kaas oo kor u qaada kalsoonida alaabta. Marka warshadaha elektiroonigga ah ay u dhaqaaqaan cufnaanta sare iyo isku halaynta, bakhtiinta saxda ah ee la kontoroolo ayaa noqday tiir-dhexaadka soo saarista xaashida naxaasta ah.
Waqtiga boostada: Mar-03-2025