Xaadirintu waa geedi socod xumo soosaarkaFoil naxaas ah. Waxay u dhaqmeysaa sidii "melekalar-the-ga heerka" dusha sare, kor u qaadida iska caabbinta daadashada halka ay si taxaddar leh isugu dheellitiran tahay saameynta ay ku yeelato guryaha muhiimka ah sida la-wanaajidka iyo kalidadii. Qodobkaani wuxuu ku dhex galay sayniska ka dambeysa farsamooyinka soo-dejinta, waxqabadka ganacsiga, iyo dhaqamada injineerinka. IsticmaalkaBirta CenevHowlgallada loo yaqaan 'Trustruplogrations' Tusaale ahaan, waxaan sahlayneynaa qiimaheeda gaarka ah ee wax soo saarka elektiroonigga ah ee dhamaadka.
1. Gudub: "Molocalar-tends thurt" oo ah fashil naxaas ah
1.1 Sida loo dhigto lakabka ee-dhiska
Iyada oo loo marayo daweynta kiimikada ama daaweynta korantada, lakabka oker-ka ah 10-50m qaabab qaro weyn oo dusha sare ahFoil naxaas ah. Waxay ka kooban tahay cufan Cu₂o, cudoo, iyo dhismayaasha dabiiciga ah, lakabkan ayaa bixiya:
- Caqabadaha jidhka ah:Kala-goynta oksijiintu waxay hoos udhaceysaa 1 × 10⁻¹⁴⁻¹⁴ cm² / s (hoos uga dhaca 5 × 10⁻⁸⁻⁸ cm² / s for copper).
- Gudbinta Elektaroonigga ah:Qulqulka dillaaca ee hadda ka soo baxa 10 dhamaaday / cm² ilaa 0.1 dhicin / cm².
- Tilmaanta kiimikada:Tamarta aan sal lahayn oo bilaash ah ayaa laga dhimayaa 72mj / m² ilaa 35mj / m², xakamaynta dhaqanka falcelinta.
1.2 Shan Faa'iidooyin Muhiim ah oo Fasaxa
| Muuqaalka waxqabadka | Foolo naxaas ah oo aan la daaweyn | Fasaxa kore ee naxaas ah | Fiicnaansho |
| Imtixaanka cusbada (saacadaha) | 24 (dhibco miridhka muuqata) | 500 (majirto xarig muuqda) | + 1983% |
| Oksidat heerkulka sare (150 ° C) | 2 saacadood (madow madow) | 48 saacadood (waxay haysaa midab) | + 2300% |
| Nolosha kaydinta | 3 bilood (bannaan oo baaxad leh) | 18 bilood (Heerka Qaadashada) | + 500% |
| Caabbitaanka xiriirka (Mω) | 0.25 | 0.26 (+ 4%) | - |
| Guul-gal-oo-gelinta Sare ee Gelinta (10Ghz) | 0.15db / cm | 0.16db / cm (+ 6.7%) | - |
2. Seefta "laba-af-dhabarka" ee lakabyada-naasaarka - iyo sida loo dheellitiro
2.1 Qiimaynta khataraha
- Hoos udhaca yar ee wanaajinta:Lakabka wax-dhigga wuxuu kordhiyaa qoto dheer maqaarka (10kanμ) laga bilaabo 0.72μm ilaa 0.72.72, iyadoo la ilaaliyo dhumuc hoosaad 30nm, kororka dib-u-dhigga ah wuxuu ku koobnaan karaa ka hooseeya 5%.
- Caqabadaha caqabadaha:Tamarta dusha hoose waxay kordhisaa iibinta xagal ka kooban 15 ° ilaa 25 °. Isticmaalka suumanka firfircoon ee gacanta (nooca nooca ah) ayaa ka bixi kara saameyntaan.
- Arimaha Assion:Xoogga isku-darka resin wuxuu hoos u dhici karaa 10-15%, kaas oo lagu yarayn karo isku darka qulqulka iyo hanaannada xaadirka ah.
2.2Birta Cenev'S Isu-dheellitirka qaabka
Teknolojiyadda Guud ee Naafada ah:
- Lakabka saldhigga:Koritaanka koritaanka ee 5nm CU₂o oo leh (111) jihaynta la doorbido.
- Lakabka dhexe:A 2-3nm Benzotriazole (BTA) filim is-ururinta.
- Lakabka kore:Wakiilka Silnetn ee wakiilka (Apeses) si kor loogu qaado adhesion resin.
Natiijooyinka Waxqabadka ee Information:
| Qiyaas maalood | Shuruudaha IPC-4562 | Birta CenevNatiijooyinka FAPPER PERPER |
| Caabbinta dusha sare (mω / sq) | ≤300 | 220-250 |
| Xoogga diirka (n / cm) | ≥0.8 | 1.2-1.5 |
| Awooda Tuurka Tooska ah ee Turnsile Tsile (MPA) | ≥25 | 28-32 |
| Heerka Socdaalka Ionc (μg / cm²) | ≤0.5 | 0.2-0.3 |
3. Birta CenevTeknolojiyadda Naafada ah: Dib-u-eegida Heerarka Ilaalinta
3.1 Nidaamka Ilaalinta afarta-tier
- Xakamaynta Ultra-Khatarta ee oxide:Gawaarida garaaca wadnaha ayaa gaaraya kala duwanaanshaha dhumuc ka dhex jira ± 2NM.
- Lakabyada isku-dhafka dabiiciga ahBTA iyo Sildane waxay si wada jir ah uga wada shaqeeyaan sidii loo yarayn lahaa heerarka jiifka illaa 0.003mm / sanadkii.
- Daaweynta Feejignaanta Dusha sare:Nadiifinta Plasma (Ar / O₂ Gaaska Gaaska) ayaa dib u soo celiya in lagu qoro xagal illaa 18 °.
- Korjoogteynta waqtiga-dhabta ah:Ellipsometry waxay hubisaa yareynta lakabka dhiska ee dhumucdeeda dhexdeeda ± 0.5nm.
3.2 Xaqiiqooyin Jawiga Jaban
- Qoyaan culus iyo kuleyl:1,000 saacadood ka dib 85 ° C / 85% RH, isbadal iska caabbinta dusha ka yar wax ka yar 3%.
- Shoog kuleylka:Kadib 200 oo wareeg oo -55 ° C illaa + 125 ° C, majiraan dildilaac ka muuqata lakabka dhiska (lagu xaqiijiyey semi-finalka).
- Cadaadiska kiimikada:Iska caabbinta 10% uumiga HCL wuxuu sii kordhaa 5 daqiiqo illaa 30 daqiiqo.
3.3 Isku-darka codsiyada oo dhan
- 5G milimitir-mowjad-motennas:28ghz galinta galinta oo la dhimay kaliya 0.17db / cm (marka la barbar dhigo tartamayaasha '0.21B / cm).
- Elektaroonigga baabuurta:Wuxuu dhaafaa ISO 16750-4 tijaabooyinka cusbada milixda, oo leh wareegyo dheeri ah ilaa 100.
- IC Substrates:Awoodda adhesion ee leh abf resin wuxuu gaarayaa 1.8n / cm (celcelis ahaan warshadaha: 1.2n / cm).
4. Mustaqbalka tikniyoolajiyadda da'ay
4.1 Tiknolojiyadda lakabka ee Atomic (ALD)
Soosaarista filimaanta naafada ah ee nanolamin-ka ee ku saleysan al₂o₃ / tio₂:
- Dhumuc::<5nm, oo ah koror la iska caabin ah ≤1%.
- CAF (Qiyaasta xayeysiiska atodic) iska caabbinta:5x horumar.
4.2 Lakabyada Xakamaynta Is-qaboojinta
Ku darista Microcapupupulit-ka xakameeyayaasha (Benzimidazole):
- Hufnaanta is-bogsashada:In ka badan 90% 24 saacadood gudahood ka dib xoqitaannada.
- Nolosha adeegga:Fidiyey ilaa 20 sano (marka la barbar dhigo heerka 15-15 sano).
Gunaanad:
Daaweynta daweyntu waxay gaarayaan isku-dheelitir la safeeyay oo u dhexeeya ilaalinta iyo shaqeynta loogu talagalayFoil naxaas ah. Iyada oo loo marayo hal-abuurka,Birta CenevWaxay yareyneysaa hoos udhaca hoos udhaca, una rogida "hubka aan muuqan" ee kor u qaadaya isku halaynta badeecada. Sida warshadaha elektiroonigga ah ay u socdaan xagga cufnaanta sare iyo isku halaynta, saxda ah iyo xakamaynta la xakameeyay waxay noqotay asaaska aasaasiga ah ee fashilka foil coper.
Waqtiga Post: Mar-03-2025